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november 2008 rev 1 1/12 EMIF06-MSD02N16 6-line ipad?, emi filter and esd protection features high design flexibility lead free package very low pcb space consumption: 3.5 mm x 1.2 mm very thin package: 0.5 mm high efficiency in esd suppression iec 61000-4-2 level 4 high reliability offered by monolithic integration high reduction of parasitic elements through integration and qfn packaging complies with following standards: iec 61000-4-2 level 4 external pins applications mobile telephones, navigation systems digital still cameras portable devices. description the EMIF06-MSD02N16 is a highly integrated device designed to suppress emi/rfi noise for interface line filtering. it is packaged in micro qfn. this filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges. tm: ipad is a trademark of stmicroelectronics figure 1. pin configuration figure 2. schematic circuit diagram 1 micro qfn 16l 3.5 mm x 1.2 mm (bottom view) 1 rdata_vcc vcc dat2_ex dat2_in wp/cd dat3_ex dat3_in rdat3_gnd cmd_ex cmd_in clk_ex clk_in dat0_ex dat0_in dat1_ex dat1_in gnd r1 r8 r9 r10 r11 r7 dat2_ex dat3_ex cmd_ex clk_ex dat0_ex dat1_ex vcc dat2_in dat3_in cmd_in clk_in dat0_in dat1_in wp/cd dat3 pull -up dat3 pull -down r12 r2 r3 r4 r5 r6 r13 gnd gnd r1 r8 r9 r10 r11 r7 dat2_ex dat3_ex cmd_ex clk_ex dat0_ex dat1_ex vcc dat2_in dat3_in cmd_in clk_in dat0_in dat1_in wp/cd dat3 pull -up dat3 pull -down r12 r2 r3 r4 r5 r6 r13 gnd gnd www.st.com
characteristics EMIF06-MSD02N16 2/12 1 characteristics table 1. absolute ratings (limiting values) symbol parameter value unit v pp esd iec 61000-4-2 contact discharge on datx_in, cmd_in and clk_in pins on all other pins contact discharge air discharge 2 8 12 kv t j maximum junction temperature 125 c t op operating temperature range - 30 to + 85 c t stg storage temperature range - 55 to + 150 c table 2. electrical characteristics (t amb = 25 c) symbol parameter v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage r d dynamic resistance i pp peak pulse current r i/o series resistance between input & output c line input capacitance per line symbol test conditions min. typ. max. unit v br i r = 1 ma 5 8 v i rm v rm = 3 v 200 na r 1 , r 2 , r 3 , r 4 , r 5 , r 6 series resistors - tolerance 20% 36 45 54 r 7 , r 8 , r 9 , r 10 , r 11 , r 12 pull-up resistors 80 90 100 k r13 pull-down resistor - tolerance 20% 375 470 565 k c line v line = 0 v, v osc = 30 mv, f = 1 mhz (under zero light conditions) 20 pf v br i pp v rm v f i f i i rm i r v v cl
EMIF06-MSD02N16 characteristics 3/12 figure 7. line capacitance versus reverse voltage applied on datx and cmd line figure 3. s21 attenuation measurement figure 4. analog cross talk measurements db 100.0k 1.0m 10.0m 100.0m 1.0g -50.00 -40.00 -30.00 -20.00 -10.00 0.00 dat0 dat1 dat2 dat3 clk cmd f (hz) db 100.0k 1.0m 10.0m 100.0m 1.0g -140.00 -130.00 -120.00 -110.00 -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 dat2 -dat3 dat2 -dat1 f (hz) figure 5. esd response to iec 61000-4-2 (+12 kv air discharge) on one input (v in ) and on one output (v out ) figure 6. esd response to iec 61000-4-2 (- 12 kv air discharge) on one input (v in ) and on one output (v out ) in out 55 v max 39 v max in out -41 v max -34 v max c line (pf) 0 2 4 6 8 10 12 14 16 0.0 1.0 2.0 3.0 4.0 5.0 v line (v)
application information EMIF06-MSD02N16 4/12 2 application information the EMIF06-MSD02N16 is a dedicated interface device for micro sd card/t-flash card in mobile phones. the device provides: esd protection emi filterering pull-up resistors card detection circuit 2.1 esd protection each pin is connected to a tvs diode able to withstand 12 kv on all pins except on datx_in, cmd_in and clk_in. 2.2 emi filtering datx, cmd and clk lines are immunized against emi radiations thanks to pi-filters. to avoid any degradation of the signal integrity at high frequency, the total line capacitance stays lower than 20 pf making the device compatible with a clock frequency up to 52 mhz. 2.3 pull-up resistors as recommended by the sd specifications (part 1 physical layer version 2.00), all the data lines datx and the cmd line must be pulled-up with resistors of 10 to 100 k to avoid bus floating not only in sd 4-bit mode but also in sd 1-bit and spi mode. for the EMIF06-MSD02N16 device the pull-up resistor value has been fixed at 90 k . this value makes the EMIF06-MSD02N16 compatible with most of the level shifters that may be used in the circuit including auto direction-sensing translators known to exhibit a weak current output. 2.4 card detection circuit the EMIF06-MSD02N16 provides the flexibility to use either mechanical card detection with a dedicated pin connected to the memory card slot or the electrical card detection using the internal pull resistor of dat3 of the micro sd card/t-flash card. in case of mechanical card detection, the user must add a pull-up on the circuit connected to the cd (card detect) of the micro-sd/t-flash slot as shown in figure 8 .
EMIF06-MSD02N16 application information 5/12 figure 8. mechanical card detection a pull-up of 90 k is embedded into the EMIF06-MSD02N16. the routing corresponding to the mechanical card detection configuration is shown in figure 9 . figure 9. circuit routing for mechanical card detection in case of electrical card detection, the user must add a pull-down on the circuit connected to the cd/dat3 pin of the micro-sd/t-flash pin as shown in figure 10 . figure 10. electrical card detection contact when inserting the card sd card pull - up resistor v dd gnd wp/cd gnd host controller card detect pin card detect host input pin 1?dat2 pin 2?cd/dat3 pin 3?cmd pin 5?clk pin 6?gnd pin 7?dat0 pin 8?dat1 card detect pull - up top level dat3 pull - up pin 4 ?vcc nc host controller host controller card detect pull-up top level dat3 pull-up card detect pin card detect host input pin 1 ? dat2 pin 2 ? cd/dat3 pin 3 ? cmd pin 5 ? clk pin 6 ? gnd pin 7 ? dat0 pin 8 ? dat1 pin 4 ? vcc nc host controller host controller bottom view to p view sd card dat3 (cd) 50 k 0 gnd host controller pull - down resistor v dd
ordering information scheme EMIF06-MSD02N16 6/12 a pull-down of 470k is embedded into the EMIF06-MSD02N16. the routing corresponding to the electrical card detection configuration is shown in the figure 11 . figure 11. circuit routing for electrical card detection 3 ordering information scheme figure 12. ordering information scheme pin 1 ?dat2 pin 2 ?cd/dat3 pin 3 ? cmd pin 5 ? clk pin 6 ? gnd pin 7 ?dat0 pin 8 ?dat1 top level dat3 pull pin 4 ? vcc pin 1?dat2 pin 2 ?cd/dat3 pin 3 ? cmd pin 5 ? clk pin 6 ? gnd pin 7?dat0 pin 8 ?dat1 top level dat3 pull- down pin 4 ? vcc nc host controller host controller top level dat3 pull -down pin 1 ? dat2 pin 2 ? cd/dat3 pin 3 ? cmd pin 5 ? clk pin 6 ? gnd pin 7 ? dat0 pin 8 ? dat1 pin 4 ? vcc top level dat3 pull -down pin 1 ? dat2 pin 2 ? cd/dat3 pin 3 ? cmd pin 5 ? clk pin 6 ? gnd pin 7 ? dat0 pin 8 ? dat1 pin 4 ? vcc nc host controller host controller bottom view top view emif 06 - msd02 n16 emi filter number of lines information package msd = application 02 = version n = narrow micro qfn 16 = 16 leads
EMIF06-MSD02N16 package information 7/12 4 package information epoxy meets ul94, v0 in order to meet environmental requirements, st offers these devices in ecopack ? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at www.st.com . table 3. micro qfn 3.5x1.2 16l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.05 0.000 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 b1 0.25 0.30 0.35 0.010 0.012 0.014 d 3.45 3.50 3.55 0.136 0.138 0.140 d2 2.70 2.80 2.90 0.106 0.110 0.114 e 1.15 1.20 1.25 0.045 0.047 0.049 e2 0.25 0.30 0.40 0.010 0.012 0.016 e 0.40 0.016 k 0.20 0.008 l 0.20 0.25 0.30 0.008 0.010 0.012 l1 0.15 0.006 m 0.20 0.008 figure 13. micro qfn 3.5x1.2 16l footprint (dimensions in mm) figure 14. marking 1 1 pin 1 index area a a1 l l1 m b1 b e k e2 e d d2 0.30 0.45 0.20 0.40 1.6 0.70 2.30 3.00 n6 dot : pin 1 identification n6 = marking
package information EMIF06-MSD02N16 8/12 figure 15. tape and reel specification note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. dot identifying pin a1 location user direction of unreeling all dimensions in mm 4.00 0.1 2.00 0.1 12.00 0.3 3.70 0.1 4.00 0.1 1.75 0.1 5.5 0.1 ? 1.55 0.05 0.80 0.1 1.70 0.1 n6 n6 n6 n6 n6 n6
EMIF06-MSD02N16 recommendation on pcb assembly 9/12 5 recommendation on pcb assembly 5.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 16. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 17. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 0.30 0.45 0.20 0.40 1.6 0.70 2.30 3.00 200 450 m m 190 420 m m 15 m 15 m 5m 5m 2800 m 300 m 2100 200 m m 350 m 350 m 50 m 50 m footprint stencil window footprint
recommendation on pcb assembly EMIF06-MSD02N16 10/12 5.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed 4. solder paste with fine particles: powder particle size is 20-45 m. 5.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
EMIF06-MSD02N16 ordering information 11/12 5.5 reflow profile figure 18. st ecopack? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 6 ordering information 7 revision history 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max table 4. ordering information order code marking package weight base qty delivery mode emif06-msdn16 n6 (1) 1. the marking can be rotated by 90 to differentiate assembly location micro qfn 6.17 mg 3000 tape and reel (7?) table 5. document revision history date revision changes 21-nov-2008 1 initial release.
EMIF06-MSD02N16 12/12 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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